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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (R) by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic (Paperback, 2012)
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Product Information
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS (R) describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS (R) that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS (R) to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS (R) allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.Product Identifiers
PublisherSpringer-Verlag New York Inc.
ISBN-139781461349891
eBay Product ID (ePID)148824281
Product Key Features
Number of Pages185 Pages
Publication NameFatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (R)
LanguageEnglish
SubjectEngineering & Technology
Publication Year2012
TypeTextbook
Subject AreaMaterial Science, Electrical Engineering
AuthorErdogan Madenci, Ibrahim Guven, Bahattin Kilic
SeriesThe Springer International Series in Engineering and Computer Science
FormatPaperback
Dimensions
Item Height235 mm
Item Weight326 g
Item Width155 mm
Volume719
Additional Product Features
Country/Region of ManufactureUnited States
Title_AuthorBahattin Kilic, Erdogan Madenci, Ibrahim Guven
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