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About this product
Product Identifiers
PublisherWiley & Sons, Incorporated, John
ISBN-100471524514
ISBN-139780471524519
eBay Product ID (ePID)855987
Product Key Features
Number of Pages512 Pages
Publication NameCooling Techniques for Electronic Equipment
LanguageEnglish
SubjectElectronics / Circuits / General, Electronics / General
Publication Year1992
FeaturesRevised
TypeTextbook
AuthorDave S. Steinberg
Subject AreaTechnology & Engineering
FormatHardcover
Dimensions
Item Height1.4 in
Item Weight30.6 Oz
Item Length9.4 in
Item Width6.5 in
Additional Product Features
Edition Number2
Intended AudienceScholarly & Professional
LCCN91-016009
Dewey Edition20
IllustratedYes
Dewey Decimal621.381
Edition DescriptionRevised edition
Table Of ContentEvaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and RadiationCooling. Forced-Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and PlatedThroughholes. Predicting the Fatigue Life in Thermal Cycling and VibrationEnvironment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.
SynopsisDetails infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers., Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.