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Vertical 3D Memory Technologies by Betty Prince (English) Hardcover Book

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Item specifics

Condition
Brand New: A new, unread, unused book in perfect condition with no missing or damaged pages. See all condition definitionsopens in a new window or tab
ISBN-13
9781118760512
Book Title
Vertical 3D Memory Technologies
ISBN
9781118760512
Publication Year
2014
Type
Textbook
Format
Hardcover
Language
English
Publication Name
Vertical 3d Memory Technologies
Item Height
0.9in
Author
Betty Prince
Item Length
9.9in
Publisher
Wiley & Sons, Incorporated, John
Item Width
7in
Item Weight
25.3 Oz
Number of Pages
368 Pages

About this product

Product Information

The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later. Key features: Presents a review of the status and trends in 3-dimensional vertical memory chip technologies. Extensively reviews advanced vertical memory chip technology and development Explores technology process routes and 3D chip integration in a single reference

Product Identifiers

Publisher
Wiley & Sons, Incorporated, John
ISBN-10
1118760514
ISBN-13
9781118760512
eBay Product ID (ePID)
202810973

Product Key Features

Author
Betty Prince
Publication Name
Vertical 3d Memory Technologies
Format
Hardcover
Language
English
Publication Year
2014
Type
Textbook
Number of Pages
368 Pages

Dimensions

Item Length
9.9in
Item Height
0.9in
Item Width
7in
Item Weight
25.3 Oz

Additional Product Features

Lc Classification Number
Tk7874.893
Reviews
"In summary, Betty Prince has produced a piece of work that is timely and will undoubtedly become a classic text for 3D memory technologies." ( 3dincites.com , 30 September 2014) "As the semiconductor memory industry moves to the third dimension a plethora of competing technologies has arisen each claiming to be the logical, lucrative successor to existing two dimensional versions. The very breadth of these new technologies can be confusing even to experienced industry professionals. Dr Prince's book appears at the right time to remove this confusion by explaining each technology's structure, function and potential advantages in a way that is accessible to both interested spectators and those working in the industry. It provides a welcome solid foundation to anyone interested in understanding the various technologies vying for success in this migration." --Andrew Walker, Schiltron Corporation, USA "This is a great review on the current state-of-the-art in the highly topical subject of vertical 3D memories. It comprises the challenges and current solutions of 3D memory integration with respective to different memory technologies. It is a highly valuable resource for researchers and engineers in the field of memory technology." -- Dr. Stephan Menzel, Forschungszentrum Jülich (PGI-7), Germany ".... one to consider if you want to bring yourself up to speed on recent research behind today's and tomorrow's 3D memory technologies. The book provides capsule summaries of over 360 papers and articles from scholarly journals organized into sections of related technologies to provide an invaluable reference on a particular 3D technology. It's a useful tool for locating research covering any of the numerous 3D technologies that are now finding their way into early production." ­-- Jim Handy, TheMemoryGuy.com, OBJECTIVE ANALYSIS Semiconductor Market Research, USA, "In summary, Betty Prince has produced a piece of work that is timely and will undoubtedly become a classic text for 3D memory technologies." ( 3dincites.com , 30 September 2014) "As the semiconductor memory industry moves to the third dimension a plethora of competing technologies has arisen each claiming to be the logical, lucrative successor to existing two dimensional versions. The very breadth of these new technologies can be confusing even to experienced industry professionals. Dr Prince's book appears at the right time to remove this confusion by explaining each technology's structure, function and potential advantages in a way that is accessible to both interested spectators and those working in the industry. It provides a welcome solid foundation to anyone interested in understanding the various technologies vying for success in this migration." -- Andrew Walker, Schiltron Corporation, USA "This is a great review on the current state-of-the-art in the highly topical subject of vertical 3D memories. It comprises the challenges and current solutions of 3D memory integration with respective to different memory technologies. It is a highly valuable resource for researchers and engineers in the field of memory technology." -- Dr. Stephan Menzel, Forschungszentrum Jülich (PGI-7), Germany "... one to consider if you want to bring yourself up to speed on recent research behind today's and tomorrow's 3D memory technologies. The book provides capsule summaries of over 360 papers and articles from scholarly journals organized into sections of related technologies to provide an invaluable reference on a particular 3D technology. It's a useful tool for locating research covering any of the numerous 3D technologies that are now finding their way into early production." -- Jim Handy, TheMemoryGuy.com, OBJECTIVE ANALYSIS Semiconductor Market Research, USA
Copyright Date
2014
Topic
Electronics / Semiconductors, Electronics / Circuits / Integrated
Lccn
2016-462932
Dewey Decimal
621.39/732
Intended Audience
Scholarly & Professional
Dewey Edition
23
Illustrated
Yes
Genre
Technology & Engineering

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