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Photonic Packaging Sourcebook: Fiber-Chip Coupling for Optical Components, Basic
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3 available
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Located in: Fairfield, Ohio, United States
Delivery:
Estimated between Tue, 11 Jun and Sat, 22 Jun to 43230
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eBay item number:386717603234
Item specifics
- Condition
- Brand New: A new, unread, unused book in perfect condition with no missing or damaged pages. See all condition definitionsopens in a new window or tab
- ISBN-13
- 9783662521359
- Type
- NA
- Publication Name
- NA
- ISBN
- 9783662521359
- Publication Year
- 2016
- Format
- Trade Paperback
- Language
- English
- Book Title
- Photonic Packaging Sourcebook : Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
- Item Length
- 9.3in
- Publisher
- Springer Berlin / Heidelberg
- Genre
- Technology & Engineering
- Topic
- Lasers & Photonics, Industrial Design / Packaging, Nanotechnology & Mems, Telecommunications, Microwaves
- Item Width
- 6.1in
- Item Weight
- 25.3 Oz
- Number of Pages
- Xix, 325 Pages
About this product
Product Information
Introduction into Photonic Packaging.- Optical waveguides.- Optical Mode Field Adaptation.- Fiber-chip-coupling.- RF Lines.- Soldering, Adhesive Bonding, Bonding.- Optical Coneection Technology.- Active Adjustment Techniques.- Passive Adjustment Techniques.- Optical Motherboard.- Fiber-Optic Modules.- From Chip Design to the Optimum Package.- Reliability Tests.- Abbreviations.- Index.
Product Identifiers
Publisher
Springer Berlin / Heidelberg
ISBN-10
3662521350
ISBN-13
9783662521359
eBay Product ID (ePID)
239640973
Product Key Features
Book Title
Photonic Packaging Sourcebook : Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Format
Trade Paperback
Language
English
Topic
Lasers & Photonics, Industrial Design / Packaging, Nanotechnology & Mems, Telecommunications, Microwaves
Publication Year
2016
Genre
Technology & Engineering
Number of Pages
Xix, 325 Pages
Dimensions
Item Length
9.3in
Item Width
6.1in
Item Weight
25.3 Oz
Additional Product Features
Number of Volumes
1 Vol.
Lc Classification Number
Tk5101-5105.9
Table of Content
Introduction into Photonic Packaging.- Optical waveguides.- Optical Mode Field Adaptation.- Fiber-chip-coupling.- RF Lines.- Soldering, Adhesive Bonding, Bonding.- Optical Coneection Technology.- Active Adjustment Techniques.- Passive Adjustment Techniques.- Optical Motherboard.- Fiber-Optic Modules.- From Chip Design to the Optimum Package.- Reliability Tests.- Abbreviations.- Index.
Copyright Date
2015
Illustrated
Yes
Item description from the seller
Seller assumes all responsibility for this listing.
eBay item number:386717603234
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Fairfield, Ohio, United States
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| Postage and handling | Each additional item | To | Service | Delivery*See Delivery notes |
|---|---|---|---|---|
| Free postage | Free | United States | Economy Shipping | Estimated between Tue, 11 Jun and Sat, 22 Jun to 43230 |
| Handling time |
|---|
| Will usually post within 10 business days of receiving cleared payment. |
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| After receiving the item, contact seller within | Refund will be given as |
|---|---|
| 30 days after the buyer receives it | Money Back |
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Seller feedback (1,023,724)
4***_ (2408)- Feedback left by buyer.
Past month
Verified purchase
thanks
a***v (27)- Feedback left by buyer.
Past month
Verified purchase
Just started to read this book but like the tests included.
w***w (848)- Feedback left by buyer.
Past month
Verified purchase
Great item, very fast service, difficult packaging done well. Recommended.