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AREA ARRAY PACKAGING HANDBOOK: MANUFACTURING AND ASSEMBLY By Ken Gilleo
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Located in: Daleszyce, Poland
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eBay item number:385780145071
Item specifics
- Condition
- Subject Area
- Data Storage, Electrical Engineering, Manufacturing Engineering, Mechanical Engineering, circuits
- Book Title
- Area Array Packaging Handbook: Manufacturing and Assembly
- ISBN-10
- 0071374930
- Subject
- Computer Science, Engineering & Technology, IT, Science, Technology
- ISBN
- 9780071374934
- Publication Year
- 2001
- Type
- Textbook
- Format
- Hardcover
- Language
- English
- Publication Name
- Area Array Packaging Handbook: Manufacturing and Assembly
- Item Height
- 2.3in
- Item Length
- 9.3in
- Publisher
- McGraw-Hill Professional Publishing
- Item Width
- 7.6in
- Item Weight
- 61.6 Oz
- Number of Pages
- 1000 Pages
About this product
Product Information
Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
Product Identifiers
Publisher
McGraw-Hill Professional Publishing
ISBN-10
0071374930
ISBN-13
9780071374934
eBay Product ID (ePID)
1923721
Product Key Features
Publication Name
Area Array Packaging Handbook: Manufacturing and Assembly
Format
Hardcover
Language
English
Publication Year
2001
Type
Textbook
Number of Pages
1000 Pages
Dimensions
Item Length
9.3in
Item Height
2.3in
Item Width
7.6in
Item Weight
61.6 Oz
Additional Product Features
Lc Classification Number
Tk7870.15.G54 2002
Table of Content
Forword Section 1: Packaging Concepts and Design Chapter 1: Introduction to Electronic Packaging Chapter 2: Electronics Industry Overview Chapter 3: Trends/Drivers in the Electronics Manufacturing Industry Chapter 4: Area Array Packaging Chapter 5: Stacked/3D Packages Chapter 6: Compliant IC Packaging Chapter 7: Flip Chip Technology Chapter 8: Options in High-Density Part Cleaning Chapter 9: MEMS Packaging and Assembly Challenges Chapter 10: Ceramic Ball and Column Grid Array Overview Section 2: Materials Chapter 11: Polyer Packaging Materials: Adhesives, Encapsulants, and Underfills Chapter 12: Hermetic Packaging Systems: Adhesive and Getter Chapter 13: Area Array Solder Spheres, Pastes, and Fluxes Chapter 14: Modern Solder and Solder Paste Chapter 15: Lead-Free Systems and Process Implications Chapter 16: Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder? Section 3: Equipment and Processes Chapter 17: Next-Generation Flip Chip Materials and Processes Chapter 18: Flip Chip Assembly and Underfilling Chapter 19: BGA and CSP Rework: What is Involved? Chapter 20: BGA Assembly Reliability Chapter 21: Die Attach and Rework Chapter 22: Liquid Encapsulation Equipment and Processes Chapter 23: Molding for Area Array Packages Chapter 24: Screen Printing and Stenciling Chapter 25: Criteria for Placement and Processing of Advanced Packages Chapter 26: Ovens in Electronics Chapter 27: Process Development, Control, and Organization Section 4: Economics and Productivity Chapter 28: Metrics: The Key to Productivity Chapter 29: Cost Estimating for Electronic Assembly Section 5: Future Chapter 30: The Future of Electronic Packaging Chapter 31: The Future of SMT Process Equipment Index
Copyright Date
2002
Target Audience
Scholarly & Professional
Topic
Industries / Computers & Information Technology, Telecommunications
Lccn
2001-041051
Dewey Decimal
621.381/046
Dewey Edition
21
Illustrated
Yes
Genre
Technology & Engineering, Business & Economics
Item description from the seller
Seller assumes all responsibility for this listing.
eBay item number:385780145071
Postage and handling
Item location:
Daleszyce, Poland
Post to:
Worldwide
Excludes:
Russian Federation, Ukraine
| Postage and handling | To | Service | Delivery*See Delivery notes |
|---|---|---|---|
| US $46.00 (approx S$ 62.08) | United States | Overnight shipping | Estimated delivery time varies |
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Seller feedback (6)
_***1 (5)- Feedback left by buyer.
Past 6 months
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Book was in as new condition. Thank you.
a***a (257)- Feedback left by buyer.
Past year
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Thanks, it was great. It reached me just now. Thanks again.
y***l (51)- Feedback left by buyer.
Past year
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Prompt shipping to California and friendly demeanor! Would purchase again!